Tag: encapsulated electronics
AMRC invents novel 3D printing process that enables encapsulated electronics
The Advanced Manufacturing Research Centre (AMRC) with Boeing has developed a ‘game-changing’ hybrid 3D printing process that could find a broad application across a...
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Modular switchgear built for faster, verified panel builds
As switchboard builders face tighter programmes and increasing scrutiny around compliance, the way enclosure, busbar and separation concepts work together has a direct impact on build time and verification effort.
