The funding is paired with matching investments from Hendon and will enable the company to launch its Defence Manufacturing Capability Modernisation Project.
Under the project, Hendon plans to upgrade its facilities by acquiring advanced manufacturing equipment to boost its Hybrid Integrated Circuit and Printed Circuit Board Assembly production capabilities and sustainment services for the defence sector.
The new equipment is expected to significantly improve the lead time and build quality of both prototypes and small manufacturing runs of electronics to the defence industry, ultimately fostering defence innovation in Australia,” Hendon said in a press release.
“I’m thrilled at the opportunity to fast-track Hendon’s modernisation, particularly in relation to our ability to quickly develop quality prototypes without the reliance on overseas partners, strengthening and significantly accelerating innovation in Defence and other industries in Australia – something we’re very passionate about,” said Brenton Judge, executive general manager for Hendon Semiconductors.
Hendon’s modernisation project received a total investment of $1.6 million, which will enable the company to procure and install state-of-the-art equipment including PCB prototyping equipment, flying probe test systems, conformal coating machine, X-ray machine, and soldering roots.
The upgraded facility is slated for completion in October 2024. Most equipment will be online in early March.