Tag: Printed Circuit Board Assembly
Hendon Semiconductors wins Federal grant to modernise defence manufacturing capability
Hendon Semiconductors, a division of Legend Corporation, has secured $690,000 from the Federal Government’s Sovereign Industrial Capability Priority Grant program.
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A business-led approach to maximising your SAP investment
Manufacturers are responding to the low-growth environment by focusing on digitisation, ESG and portfolio reshaping, transforming into more digital, resilient, and sustainable organisations.
