Leading global semiconductor company AMD has announced a massive investment of more than $10 billion across the Taiwan technology ecosystem.
In its recent statement to the media, AMD said the funding is aimed at expanding strategic partnerships and scaling up advanced packaging manufacturing to meet the surging demand for AI infrastructure.
In collaboration with both Taiwanese and global partners, the company plans to advance cutting-edge silicon, packaging, and manufacturing technologies.
These developments build upon AMD’s established history with chiplet architectures, high-bandwidth memory integration, 3D hybrid bonding, and rack-scale system design for next-generation AI infrastructure.
Dr Lisa Su, Chair and CEO of AMD, emphasised the market drivers behind the investment.
“As AI adoption accelerates, our global customers are rapidly scaling AI infrastructure to meet growing compute demand,” Su said.
“By combining AMD leadership in high-performance computing with the Taiwan ecosystem and our strategic global partners, we are enabling integrated, rack-scale AI infrastructure that helps customers accelerate deployment of next-generation AI systems.”
A key part of the investment is AMD’s collaboration with Taiwanese companies ASE and SPIL, as well as other industry partners, to design next-generation wafer-based 2.5D bridge interconnect technology.
For industrial operations, enhancements from this project can mean faster, more efficient systems, delivering greater performance-per-watt while operating with practical power and cooling limits.
AMD has also achieved a significant manufacturing milestone in panel-based innovation through its collaboration with PTI.
The partners have successfully qualified the industry’s first 2.5D panel-based EFB interconnect, allowing customers to deploy more efficient AI systems while improving overall economics.
AMD and its industry partners are accelerating the deployment of the AMD Helios rack-scale platform, targeting a rollout in the second half of 2026.
To transition the platform from the design phase into high-volume manufacturing, AMD is working with leading ODM partners, including Sanmina, Wiwynn, Wistron, and Inventec.
