Tag: Printed Circuit Board Assembly
Hendon Semiconductors wins Federal grant to modernise defence manufacturing capability
Hendon Semiconductors, a division of Legend Corporation, has secured $690,000 from the Federal Government’s Sovereign Industrial Capability Priority Grant program.Â
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Driving the future of smart energy: GridBeyond and ABB unveil new white paper on battery storage innovation
As industries adopt cleaner, more intelligent energy solutions, the ability to manage, store, and trade energy efficiently is increasingly vital to sustaining a competitive edge.
