Additive Mfg & 3D Printing

Australian metal additive manufacturing company Titomic has received a purchase order from Deutsche Bahn Fahrzeuginstandhaltung GmbH to supply manufacturing equipment intended to support the maintenance of rolling stock components across the German rail network.

UNSW Canberra researchers have developed a new 3D-printed bone implant that could transform the manufacturing of personalised medical devices and improve treatment for fractures and bone injuries. 

MIT researchers have developed a new AI system that allows people to create personalised 3D-printed objects that are both unique and durable.

The global manufacturing sector is poised for significant expansion in polymer extrusion 3D printing, according to a new report by Additive Manufacturing Research (AM Research). 

Velo3D has entered into a Cooperative Research and Development Agreement with the US Army’s DEVCOM Ground Vehicle Systems Center to develop and qualify additively manufactured metal parts aimed at addressing supply chain challenges affecting ground combat vehicles and other military systems.

Manufacturing expertise from London-based additive manufacturer 3D People has been used to produce a critical component for a maritime efficiency system trialled on a liquefied natural gas carrier.

Duke School of Medicine has announced the launch of a four-year, USD 3.2 million research effort aimed at developing and using a 3D-printed living lung model to better understand how influenza interacts with bacteria in the human respiratory system.

Additive Manufacturing Research (AM Research) has published a new market report outlining its assessment of the polymer extrusion 3D printing sector, estimating the market will be worth USD 2.2 billion in 2025 and grow to USD 6.1 billion by 2034. 

MIT engineers have developed a 3D-printable aluminium alloy that is significantly stronger and more heat-resistant than conventional aluminium, a breakthrough that could support the development of lighter components for aerospace and other industrial applications, according to the institute.

Engineers at the University of Texas at Austin are leading a collaborative research effort to develop a new 3D printing approach that could change how semiconductor chips and electronic packages are manufactured.