Tuesday, June 30, 2026

New factory in China opens for humanoid robot mass production

EngineAI Robotics has officially opened its new EngineAI Manufacturing Base in Shenzhen, China, marking the company’s transition to large-scale manufacturing of humanoid robots.

Komatsu, Atlassian Williams F1 team kick off 3rd Engineering Academy 

Atlassian Williams F1 Team and global manufacturing company Komatsu have announced the third edition of their joint program to recruit and accelerate the careers of young engineers.

EngineAI expands manufacturing capacity as first T800 humanoid robots enter mass delivery

EngineAI has launched a new intelligent manufacturing base in Shenzhen and announced that the first batch of its T800 humanoid robots has rolled off the production line, marking the start of mass deliveries and an expansion of its manufacturing capabilities.

Fujitsu partners with Anthropic, OpenAI to drive Japan’s AI transformation

Fujitsu Limited has announced dual strategic collaborations with artificial intelligence developers Anthropic PBC and OpenAI, aiming to accelerate AI transformation across Japanese enterprises.

ProPak China 2026 to showcase global processing, packaging innovations in June

Top players in the global processing and packaging industry are set to gather at ProPak China 2026, the 31st International Processing and Packaging Exhibition, in Shanghai from June 15 to 17.

China’s Zoomlion introduces hybrid, autonomous mining tech at mining expo

Zoomlion Heavy Industry Science & Technology recently showcased its latest advancements in mining technology at the 2026 Global Mining Machinery Expo.

AMD unveils $10 billion AI infrastructure push in Taiwan

Leading global semiconductor company AMD has announced a massive investment of more than $10 billion across the Taiwan technology ecosystem.

Asahi Kasei unveils new photosensitive polyimide film for AI chip packaging

Global materials and technology company Asahi Kasei is developing a new photosensitive film designed to streamline advanced panel-level packaging for semiconductors.

US plastics manufacturing sector signals resilience despite pressures

The Plastics Industry Association (PLASTICS) has released a new economic analysis detailing how the United States plastics industry is navigating challenges amid macroeconomic growth, international instability, and escalating energy expenses.

90% of manufacturers consider digital transformation as baseline requirement – global survey

A shift is occurring in the global industrial sector as manufacturers move away from small-scale experimentation and focus on deploying capabilities across entire operations, according to Rockwell Automation’s 11th annual “State of Smart Manufacturing” report.
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Responding to manufacturing demand and performance signals

Australian manufacturers are navigating a challenging environment. Just as output had returned to growth, higher fuel and freight costs, rising input prices and global supply chain disruption renewed pressure on margins and cash flow.